Nova is a leading global innovator and key provider of dimensional, materials, and chemical metrology solutions for advanced process control in semiconductor manufacturing.
What is your raison d'être, and how has Nova best served the semiconductor industry since its inception?
Nova’s role in the semiconductor industry is centered on process control. In semiconductor manufacturing, creating a die requires key building blocks—lithography, deposition, etching, and polishing, all closely monitored through process control. Our focus is on ensuring precision at the nanometer level, crucial for accurate and efficient semiconductor production. Process control enables manufacturers to oversee and refine processes, maintaining tight control over critical parameters like dimensions and material composition. By delivering these insights, we support our customers, primarily manufacturers, in achieving higher yields and maximizing their output quality. This is our core value to the semiconductor sector—equipping manufacturers with tools that enhance both the reliability and efficiency of their operations.
Can you give a specific example of how Nova’s process control contributes to cost savings or increased competitiveness in the industry?
The semiconductor industry revolves around achieving high yield rates, which measure the proportion of viable dies produced per wafer. When we develop new technologies, such as moving from 14 nanometers down to 2 nanometers, each generation requires advanced process control to ensure maximum yield. This yield rate is directly tied to our customers’ ability to meet demand at a competitive price.
Nova's metrology solutions are vital in achieving these results, as they enable precise process adjustments that prevent costly errors, reduce waste, and support high-volume production. Ultimately, our technology plays a fundamental role in maintaining competitive pricing and output levels.
In terms of acquisitions, like your recent purchase of Ancosys, how has Nova evolved over the last 20-30 years to meet industry demands and prepare for AI-driven requirements?
AI represents a significant challenge as it requires increasingly complex chips with intricate architectures and 3D structures. Over the years, we have expanded its capabilities to address these demands, beginning with dimensional metrology, advancing into materials metrology with a 2015 acquisition, and most recently, adding chemical metrology through our acquisition of Ancosys. This growth reflects our strategy to address the diverse and complex needs within process control, from advanced node manufacturing to emerging packaging techniques. We’re committed to staying at the forefront of process control by developing innovative technologies that support advanced manufacturing requirements, such as AI’s processing power demands.
As chips get smaller and the industry becomes more intricate, how is Nova incorporating advanced technologies like machine learning to support this progression?
We were a pioneer in integrating machine learning into process control about seven years ago. With chip architectures evolving towards smaller and more intricate designs, machine learning has become crucial in maximizing our systems' capabilities beyond traditional hardware limitations. Using machine learning alongside physical metrology allows us to model and anticipate manufacturing challenges, thus enhancing our ability to provide precise process control. This approach enables us to support our clients’ drive for innovation, allowing them to push technological boundaries by continually refining chip architectures and optimizing production outcomes.
With recent advancements in packaging and chiplets, how does Nova ensure a seamless transition of expertise to adjacent markets while managing acquisitions?
Transitioning to adjacent markets is challenging, but we prioritize culture and vision alignment. Like in the global campaigns of banks such as HSBC, which emphasized the importance of “global yet local,” we focus on integrating infrastructure while respecting local cultural practices. This is essential as we work across multiple geographies, from Asia to the U.S.
Our “North Star” approach guides this integration, helping us align our goals with long-term industry trends. This focus ensures that our expansion into areas like advanced packaging remains purpose-driven and culturally cohesive, fostering success across varied markets.
Could you elaborate on Nova's North Star vision?
While our North Star vision doesn’t fit into a single sentence, it is a strategic framework guiding our growth over the next decade. It encompasses goals related not only to our business size but also to our core competencies and future aspirations, aligning them with industry advancements and our organizational culture. This strategic clarity is fundamental for making informed decisions in acquisitions, technology development, and expansion.
What are some of the factors that keep you up at night in terms of Nova's future and industry challenges?
There are several, but competition and market evolution are primary concerns. The semiconductor industry's rapid growth—projected to reach a trillion dollars by 2030—demands continuous innovation. We must stay ahead, ensuring our tools remain relevant and essential to our customers’ processes. Additionally, external factors like global economics, geopolitics, and the sustainability challenges associated with increased production capacity weigh on us. Developing new technologies and ensuring they meet future requirements is a long-term investment, often spanning five years. Our close collaboration with customers is vital to anticipate and prepare for these future needs effectively.
In your view, what emerging applications or technologies excite you most as we look toward 2030?
One area with great promise is in medical devices, particularly those that improve quality of life for patients. For Nova, the primary goal is to enable these applications by enhancing semiconductor performance—whether through increased computing power, lower energy consumption, or reduced size. Our work isn’t tied to specific applications; rather, we focus on creating foundational technology that supports diverse future use cases. These building blocks are what we believe will enable transformative innovations across industries, potentially in ways that we can’t yet fully envision.
Are there any key milestones or technological advancements Nova anticipates in the near future?
We are particularly excited about advancements in packaging architectures, such as high bandwidth memory and hybrid bonding, which allow more efficient and powerful chip integration. As we apply our advanced metrology solutions to these new architectures, we see significant growth potential in packaging. These techniques will help maintain the industry’s growth curve, supporting the high-yield production required for advanced nodes and beyond.
